"Measurement and Field Simulation based Characterization of Plastic IC
Packages," Ferenc Mernyei, 6th Topical Meeting on Electrical Performance
of Electronic Packaging, San Jose, Oct. 1997.
"Measurement and Field Simulation based Characterization of Plastic IC
Packages," Ferenc Mernyei, 6th Topical Meeting on Electrical Performance
of Electronic Packaging, San Jose, Oct. 1997.
"A
Novel Approach to 3-D Modeling of Packaged RF Power Transistors Ted Johansson
and Torkel Arnborg,”IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES,
VOL. 47, NO. 6, JUNE 1999.
"Carsem's
electrical data,"; A good basis for a lumped package model (lead frame&bondwires)
for most modern plasitic packages.
"Fundamentals
of IC Assembly," Virginia Tech.
The
Nordic Electronics Packaging Guideline; Chapter
A: Wire Bonding
Bondwire Current density and
Resistance Properties