PDF Icon "Measurement and Field Simulation based Characterization of Plastic IC Packages," Ferenc Mernyei, 6th Topical Meeting on Electrical Performance of Electronic Packaging, San Jose, Oct. 1997.

 PDF Icon "A Novel Approach to 3-D Modeling of Packaged RF Power Transistors Ted Johansson and Torkel Arnborg,”IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES, VOL. 47, NO. 6, JUNE 1999.

 PDF Icon "Carsem's electrical data,"; A good basis for a lumped package model (lead frame&bondwires) for most modern plasitic packages.

 PDF Icon "Fundamentals of IC Assembly," Virginia Tech.

 PDF Icon  The Nordic Electronics Packaging Guideline; Chapter A: Wire Bonding

Bondwire Current density and Resistance Properties